Canteliver Probe Card
MPI Cantilever Probe Card is greatly utilized on gold bump and pad wafer screening for Screen driver, logic, and memory product. MPI’s cantilever probes will be the corresponding reply towards the demands of fine pitch, compact pad dimensions, large velocity, fewer cleaning, multi-DUT, large pin depend, and ultra-small leakage necessities. With remarkable craftsmanship, modern architecture and established methodologies based on mechanical and electrical simulation/measurement effects, producing MPI the best cantilever company worldwide.
FCB Probe Card
The FCB Probe Card is considered the most experienced technological innovation of buckling beam probe card. It is aimed to realize the semiconductor ship manufacture time-to-sector (TTM) and price of test (COT) desire. FCB is often a established Remedy for a number of semiconductor output checks from early engineering pilot-operates to superior quantity producing (HVM). FCB is ready for unit necessitating large signal integrity probing (SI) and/or energy integrity probing (PI). Applications consist of reducing-edge SiPs/SoCs, WLP, graphic processors, micro processor, industrial microcontrollers, and more. FCB assures the world’s best In general Charge-of-ownership (COO) for various DUT purposes.
EVS Probe Card
The EVS Probe Card is undoubtedly an enhancement over the standard buckling beam probe card. Key characteristics are greater read more current carrying ability (C.C.C.) and reduce balanced Call power (BCF), and Over-all MEMS-like traits. EVS can easily satisfy the need of Superior wafer probing. Precise alignment and fantastic planarity Management would be the critical factors contributing to stable Make contact with resistance. With its ability and effectiveness, EVS Probe Card is an ideal choice for Innovative probe cards.
Osprey probe card
The Osprey probe card is MPI’s Resolution to desire for ever finer pitch. It truly is made for more compact Al pad, and is also ideal for tiny pitch software with peripheral and whole array pattern. With specific alignment and far better planarity Management, Osprey can access better productiveness by multi-DUT style. The forming wire (FW) kind needle created with MPI’s own micro fabrication system not simply delivers high-high-quality general performance but in addition will allow simple needle alternative and shortens maintaining cycle time.
Kestrel Probe Card
The Kestrel Probe Card is supplied with MEMS wire (MW) needle which is suitable for the demand of small force probing. What's more, it comes along with the chance to fulfill higher C.C.C. and significant pin counts application. The MEMS method makes certain highly steady needle features, and also the Exclusive construction design and style enables precise alignment and planarity Management.
MPI probe card division provides a wide range of solutions to the semiconductor wafer level test market. Integrated Circuit (IC) applications include Drivers, Logic, CIS, RF, Flip Chip and Cu Pillars. MPI’s comprehensive designs, robust manufacturing and state-of-the-art tooling, enables MPI to provide unsurpassed solutions globally for your challenges both today and for many generations to come.
https://www.mpi-corporation.com/probecard/